Samsung reveals Hybrid-Substract Cube (H-Cube) technology with the help from Amkor technology! Read to find out more!!


Samsung Electronics is a South Korean multinational manufacturing organization. Samsung is the world leader company in electronics and gadgets. It was founded by Lee Byung-Chul on the 13th of January, 1969. The headquarters of Samsung Electronics is in the Yeong tong district of South Korea. Samsung has served not only in South Korea but also in the whole world. The range of services provided by Samsung exceeds from mere mobile phones to home appliances, like television, refrigerator, etc. With their advanced Artificial Intelligence usages, their influence is worldwide. In the latest news, it is known that its net worth per year is around US$22.4 billion making it the 12th richest company worldwide.

Samsung Electronics revealed today that they have succeeded in making Hybrid-Subtract Cube (H-Cube) technology its latest 2.5D packaging solution specialized for HPC, AI, data center, and network products for high-performance applications with the help of Amkor technology, a semiconductor manufacturing company which is one of the world’s largest providers of outsourced semiconductor packaging and test practices. It was founded in 1968.

Structures and Features of H-Cube.

Samsung Electronics has come a long way since 2005 when it made the strategy to enter the manufacturing marketplace. With the latest introduction of H-Cube, it has made a vast improvement and demand in the electronics market. In simple words, H-Cube can store high-performance chips in very compact sizes!
Often people face a lot of issues regarding storage facilities. The Samsung H-Cube system call attention to a hybrid platform combined with a first-class pitch platform that can fine bump connections and have the ability to HDI (High-Density Interconnection). The 2.5D packaging helps logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a compact form factor. With the help of H-Cube, massive proportions can be made to be adjusted inside a 2.5D packaging. The main purpose is this because large-area packaging becomes main as the quantity and size of chips inside a package expand rapidly. Furthermore, it is main to have high-speed broadband communication. Also, fine-pitch substrates are main however the price will increase if the size grows bigger! An HDI substrate (PCB module) can come under the fine pitch substrate get interaction with the board system

Since HPC (High-Performance Computer), AI, and networking applications have recently escalated the specifications that require large-area packaging is becoming the main point as the number and size of chips mounted in one package increases or high-bandwidth communication is required.
For enhancing the reliability of the H-Cube Solution, Samsung put in its proprietary signal/power integrity analysis technology. This technology helps in delivering balanced power without causing distortion or signal loss while accumulating up more than one HBM and logical chips. If six or more HBMs are combined, it is harder to create a huge substrate. As a result, the efficiency diminishes. The Korean tech behemoth solved this issue with the help of a hybrid substrate structure, which forms a mixture of easily processable HDI substrates and a high-end fine-pitch platform over a huge expanse. Again when the solder ball pitch is decreased by thirty-five percent, the fine-pitched platform size is also supposed to decrease. The solder ball pitch electrically connects the platform and the chip.



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